In a first for India’s semiconductor industry, Tata Electronics has signed a Memorandum of Understanding (MoU) with Robert Bosch GmbH to ally to develop cutting-edge semiconductor packaging and manufacturing facilities in India. The partnership will be around Tata’s upcoming facilities in Gujarat and Assam, further establishing India as a global chip-manufacturing centre.
This strategic partnership is aimed at reducing India’s electronics supply chain’s dependency on imports, as per the government’s vision of being self-dependent in the production of semiconductors. Tata Electronics’ new OSAT (Outsourced Semiconductor Assembly and Test) factory in Assam and its wafer fab in Gujarat will be the drivers of this initiative.
Tata and Bosch, under the MoU, will explore possible areas of collaboration in semiconductor assembly, advanced packaging technologies, and vehicle electronics development, a space that is rapidly getting digitalised. The development will most likely boost innovation in sectors like automotive, industrial automation, and consumer electronics.
The alliance is also a part of India’s overall semiconductor drive under the ₹1.26 lakh crore scheme of government incentives, and comes after recent approvals by the Centre of several chip-making plants as part of efforts to make India a global semiconductor hub.
By meshing Tata’s production strength with Bosch’s worldwide experience in microelectronics, this partnership can potentially create a strong, forward-looking value chain in semiconductors with Indian origins.
