Micron has announced plans to invest approximately $7 billion over the next five years to enhance memory chip production in Singapore.
The announcement coincided with the groundbreaking ceremony for a new High-Bandwidth Memory (HBM) advanced packaging facility in the city-state.
The facility, which will be the first of its kind in Singapore, aims to strengthen the local semiconductor ecosystem and foster innovation. Located adjacent to Micron’s existing operations, the facility will integrate greenhouse gas abatement, water recycling, and waste circularity measures, aligning with the company’s sustainability goals.
Scheduled to begin operations in 2026, the new fab will support long-term manufacturing needs for NAND memory. The project is expected to create an initial 1,400 jobs in packaging development, assembly, and test operations, with potential growth to 3,000 roles as the site expands.
“As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly,” said Sanjay Mehrotra, president and CEO of Micron. “With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.”
